Dołączył: 24 Maj 2020
|Wysłany: Sob Sty 09, 2021 09:23 Temat postu: Panasonic Commercializes Halogen-free Multi-layer Circuit Bo
|Panasonic Commercializes Halogen-free Multi-layer Circuit Board Material
Panasonic Corporation announced today that it has commercialized halogen-free, ultra-low transmission loss, multi-layer circuit board material, called Halogen-free MEGTRON6 (Representative part number: R-5375), suited for communications infrastructure equipment such as fifth-generation (5G) mobile communication systems. Production will begin in April 2019.To get more news about Halogen Free PCB, you can visit pcbmake official website.
With the upcoming launch of 5G mobile communication system services, greater-capacity and faster data transmission speeds will be needed. Multi-layer circuit board material used as a key component in equipment such as servers and routers that support core systems for communications networks will require halogen-free material from the viewpoint of environmental protection, not to mention high-capacity and high-speed data transmission. Panasonic has commercialized this multi-layer circuit board material that is ideal for communications infrastructure equipment by achieving a halogen-free material that shows low transmission loss, high heat resistance, and high reliability, based on the company's proprietary resin design technology and compounding technology.
There is a growing need for environment-friendly halogen-free material for circuit board materials used in communications infrastructure equipment. To maintain flame retardation, the use of non-halogen flame retardants is necessary, but the downside was increased transmission loss, particularly in the high-frequency range. Achievement of large-capacity and high-speed transmission as required by communications infrastructure equipment by using halogen-free material was therefore a challenge. However, the company has now achieved flame retardation with halogen-free material as well as low transmission loss in the high-frequency range by applying its proprietary resin design technology and compounding technology. As a result, large-capacity and high-speed data transmission was achieved, which will contribute to the rollout of the 5G mobile communication system.
This material, created using the company's own resin design technology and compounding technology, offers excellent reflow heat resistance, insulation reliability, and high glass transition temperature as well as a high thermal decomposition temperature. This multi-layer circuit board material achieves high reliability in high-temperature environments, thereby contributing to reliable operation of communications infrastructure equipment.
This material achieves outstanding ease of manufacturing and processing in producing multi-layer circuit boards with over 20 layers based on the company's own resin design technology, and enables the adoption of environment-friendly halogen-free circuit board material in communications infrastructure equipment that requires very high numbers of board layers.